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AMD 下代 AI 机架解决方案“长胖”：Helios 采用双宽机架设计 Telegraph | 原文

AMD 下代 AI 机架解决方案“长胖”：Helios 采用双宽机架设计 - IT之家

IT之家 6 月 13 日消息，AMD 在 Advancing AI 2025 大会上预览介绍了搭载下一代 Instinct MI400 显卡加速器的 Helios AI 机架解决方案。而该系统除实际性能升级外的另一大变化就是其宽度从 1 个机架提升到了 2 个机架： "Helios" 的竞争对手是英伟达的 Vera Rubin NVL144 机架系统，后者并未像 "Helios" 这样横向物理扩展。

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Create: 2025-06-13
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AMD 下代 AI 机架解决方案“长胖”：Helios 采用双宽机架设计 Telegraph | 原文

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IT之家 AMD 下代 AI 机架解决方案“长胖”：Helios 采用双宽机架设计 Telegraph | 原文